lead free reflow oven machine

LK-1200 high-end lead free reflow soldering machine

Total power : 99kw
PCB Max. width: 50-400mm
Heating zone length :4675mm
Cooling zones quantity.: Top 3, bottom 3
Product description: reflow oven, smt lead free reflow oven, soldering machine, smt reflow oven
INQUIRY

LK-1200 high-end lead free reflow soldering machine

Features:

1. Reinforced main hanging bracket to guarantee there is no deforming and board jamming occurred.

2. The dual-rails conveyor is able to improve the production efficiency as well as power & cost.

3. 15% heat transferring efficiency was improved to deal with the lead free process with more complicated and larger products.

4. New cooling configuration to make the filtered or reclaimed air back to oven chamber, it reduced the thermal loss as well as get better flux reclamation.

5. Double-track dual-speed, single machine cost, double production capacity, energy saving up to 65%.

Model	LK-1200	Control	Industrial computer
Heating zones quantity.	Top 12, bottom 12	Cooling zones quantity.	Top 3, bottom 3
Heating zone length	4675mm	Current plate	Thick copper plate
Weight	APPROX:3360KG	Dimension	705014301530mm
Exhaust capacity	10㎡/min×2	Color	Grey
*Control system*
Electricity supply	3P 380V/220V 50/60HZ	Temp. control range	Room temp.～300℃
Total power	99KW	Temp. control accuracy	±1℃（static state）
Start power	44KW	Temp. control method	PID +SSR drive
Consumption power	12KW	PCB temperature deviation	±1.5℃
Speed control	3 sections with 3 inverters	Data save	All profiles can be saved
Warm up time	Apprx.30minute	Abnormal alarm	High, low temp. alarm
*Conveying system*
Rail structure	2 Sectional structure	Rail fixed method	Front fix
Chain	Stuck-free stainless steel type	Conveying height	900±20mm
PCB Max. width	50-400mm	Conveying method	Rail+ chain
Component height	Top/bottom 30mm	Conveying speed	300-2000mm
Conveying direction	Left to right	Lubrication	Automatic
*Cooling system*
Cooling method	Forced air cooling
*Heating features*
Heating zones	Top 12,bottom 12（4675mm）can meet the need of the peak lead-free technique.
Cooling zones	After cool down by air, PCB temp. is ≤50℃ at the exit.
Warm up time	From the normal temp. to set temp, approximate 30 minutes.
Warm up sequence	Warm up from two side, save the power and time
Profile transfer time	＜15min
Heating zone temp. control accuracy	±1℃
PCB temp. deviation	±1.5℃
Empty→ full load heat balance respond time	≤20 s

Keywords:

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